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Torrance, CA (PRWEB) August 29, 2006 When designing ball grid array components for high reliability applications it is very important to first understand the material system that will be used to manufacture the circuit card and electronic components that will be assembled into the desired electronic system. Designers need to be able to balance the
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Oxford, UK (PRWEB) August 9, 2008 BizEsp Limited, the high technology electronics materials specialist company based in the international technology hub of Oxford, England – announced today the launch of a new project to develop high tech production equipment for the manufacture of ufBGA spheres of diameters down to 75 microns. Spheres down to this
