BizEsp

Advanced Electronics Materials Technologies: BizEsp launches OXFORD SOLDERS offering Solders, Solder Powders, Solder Pastes, Fluxes, Adhesives and BGA Spheres for Printed Circuit Board (PCB) Assembly

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Oxford, United Kingdon (PRWEB) February 26, 2008 BizEsp Limited, “The Electronics Materials Specialists”, specialising in the application of fundamental sciences for advanced technology development and problem solving announced today the launch of its OXFORD SOLDERS brand in the China market for electronics assembly products. Product line up will include solder powders, solder pastes, fluxes and […]

Advanced Electronics Materials Technologies: BizEsp launches OXFORD SOLDERS offering Solders, Solder Powders, Solder Pastes, Fluxes, Adhesives and BGA Spheres for Printed Circuit Board (PCB) Assembly Read More »

BizEsp wins South East England Development Authority (SEEDA) Funding to Build Ultra-Fine Ball Grid Array (BGA) High Technology Production Lines

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Oxford, UK (PRWEB) August 9, 2008 BizEsp Limited, the high technology electronics materials specialist company based in the international technology hub of Oxford, England – announced today the launch of a new project to develop high tech production equipment for the manufacture of ufBGA spheres of diameters down to 75 microns. Spheres down to this

BizEsp wins South East England Development Authority (SEEDA) Funding to Build Ultra-Fine Ball Grid Array (BGA) High Technology Production Lines Read More »

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