Domestic Chip Bottleneck Breakthrough Paves the Way for China’s 3G Launch – Comlent samples World’s 1st CMOS TD-SCDMA Transceiver
SHANGHAI, China (PRWEB) October 30, 2006 Comlent Technology Inc., the only Radio Frequency Integrated Circuit (RFIC) corporate member of China’s 3G standard TD-SCDMA Industry Alliance (TDIA), announced today that it starts sampling RFIC transceiver and analog baseband (ABB) chipset in advanced CMOS technology for TD-SCDMA, the world’s first in its kind. The chipset includes […]