cto

OCTAVO CREATES A 1GHZ COMPUTER THAT FITS INTO A 27X27MM SIP PACKAGE

OCTAVO CREATES A 1GHZ COMPUTER THAT FITS INTO A 27X27MM SIP PACKAGE

Leave a Comment / Electronics News Updates /

The OSD335x C-SiP System-in-Package (SiP) developed by Octavo, is a concept package that is modeled on its previous Sitara AM335x based SiP by including up to 16GB eMMC, an oscillator along with 1GB DDR3, PMIC, LDO, and EEPROM. The OSD335x C-SiP, is the most consolidated System-In-Package (SiP) module ever made. Modeled like its predecessors, the OSD335x C-SiP incorporates the Cortex-A8 based Texas […]

OCTAVO CREATES A 1GHZ COMPUTER THAT FITS INTO A 27X27MM SIP PACKAGE Read More »

Chirp Microsystem Made The Smallest And Most Accurate Ultrasonic Time-of-Flight Sensors

Leave a Comment / Electronics News Updates /

Recently Californian startup Chirp Microsystems officially announced two discrete ultrasonic Time-of-Flight (ToF) sensors, the CH-101 and CH-201, with maximum sensing ranges of 1m and 5m, respectively. Both chips have a 3.5×3.5mm package and they are powered by same ASIC or application-specific integrated circuit for signal processing. To achieve different sensing ranges, the Piezoelectric Micro-machined Ultrasonic Transducers (PMUT), the

Chirp Microsystem Made The Smallest And Most Accurate Ultrasonic Time-of-Flight Sensors Read More »

Scroll to Top