Most of smartphones parts are made of silicons and other compounds, which are expensive and easily-breakable. This problem is making all of smart devices manufacturers looking for stronger and cheaper solutions. By combining a set of materials, a group of researchers have successfully discovered a new material which could finally finish the disaster of cracked smartphone […]
A New Material For Unbreakable Smart Devices Read More »
Good soldering station is usually a fundament of a workplace. Desoldering station is usually a necessity if you work in development or service. And a hot-air station? – this one is becoming a must at any development or rework of PCBs with SMT components. If we already know, that it´s ideal to have all these
WXR3031 rework station will replace you three devices Read More »
An alliance led by IBM Research, together with New York academic institution SUNY Polytech and with Samsung and GlobalFoundries, has produced 7nm (nanometer) node test chips with functioning transistors. Continuing semiconductor scaling down to feature sizes of 7 nm is expected to yield further gains in performance, and lower power levels, but in IBM’s words,
IBM shows working devices fabricated at 7nm node Read More »
Aesthetic and relatively massive enclosures from company Fastron are the novelty able to provide an attractive look to your devices. Metal enclosures are a stable part of our offer. We usually choose them, when wanting to produce a device with a higher mechanical rigidity or with a higher resistance to disturbances (EMI shielding) but even
Fastron – metal enclosures with fluent shapes Read More »
Orchard Park, NY (PRWEB) February 21, 2011 MobileApp Systems LLC, a developer of mobile software and hardware solutions for demanding applications, is proud to announce the immediate availability of iLuaBox version 1.2, a Lua scripting environment running on all Apple iOS 4.2+ compatible devices. Lua is a powerful, fast, lightweight, embeddable scripting language. It
iLuaBox 1.2 Scripting Application Now Available for all iOS 4.2+ Devices Read More »
Chicago, Il (PRWEB) April 06, 2011 Open Kernel Labs (OK Labs), provider of embedded virtualization software for mobile phones and broadband Internet devices, today announced that its market leading software, OKL4, has been deployed in more than 1.2 billion mobile devices. In recognition of OKL4 market penetration, the company has been included in the
Open Kernel Labs Software Tops the Charts Now Deployed in 1.2 Billion Mobile Devices Read More »
San Francisco, CA (PRWEB) June 07, 2011 Today at the annual Apple developer conference, WWDC, Urban Airship unveils key elements of its enterprise strategy for mobile messaging, including a huge infrastructure investment in its realtime messaging platform; introduction of Urban Airship Helium, an end-to-end push messaging platform; and the general availability of premium push notification
Las Vegas, NV (PRWEB) January 5, 2006 Today Eleven Engineering Incorporated announces the Squeak 1C digital wireless audio modules featuring XInC2 are production ready. The modules are optimized for low power operation with Chipcon’s CC2400 transceiver and the XInC2 wireless processor from Eleven. In fact on a single charge, a 3.7 V Li-Ion battery with
Vancouver, BC (PRWEB) June 21, 2011 Techsol is now offering an extremely cost-effective computer with a Color TFT LCD and Touch panel interfaces plus assorted serial, Audio, and other I/O, targeting low-cost devices such as industrial handhelds and other HMI (Human-Machine Interface) applications. This standard, off-the-shelf, Medallion Linux on ARM-powered computer module features: 500 MIPS
Techsol’s TSCM-233 Computer Module Enables Low-cost Hand-held Devices Read More »
Honolulu, HI (PRWEB) March 15, 2006 The group reports their findings titled “Integrating nanowires with substrates using directed assembly and nanoscale soldering” in the January 2006 edition of IEEE Transactions on Nanotechnology. In this paper, they demonstrate a strategy that utilizes a combination of directed assembly and soldering to form low-resistance contacts between nanowires and
Large-scale Fabrication of Integrated Nanoelectronic Devices Moves Closer Read More »
