Advanced Electronics Materials Technologies: BizEsp launches OXFORD SOLDERS offering Solders, Solder Powders, Solder Pastes, Fluxes, Adhesives and BGA Spheres for Printed Circuit Board (PCB) Assembly

Oxford, United Kingdon (PRWEB) February 26, 2008 BizEsp Limited, “The Electronics Materials Specialists”, specialising in the application of fundamental sciences for advanced technology development and problem solving announced today the launch of its OXFORD SOLDERS brand in the China market for electronics assembly products. Product line up will include solder powders, solder pastes, fluxes and […]

Advanced Electronics Materials Technologies: BizEsp launches OXFORD SOLDERS offering Solders, Solder Powders, Solder Pastes, Fluxes, Adhesives and BGA Spheres for Printed Circuit Board (PCB) Assembly Read More »