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Lead-Free Overview of SMT Manufacturing is Subject of Free, Live Web Seminar on Thurs., Aug. 18 at 11 AM, U.S. E.T. — Hosted by Speedline Technologies —

FRANKLIN, Mass. (PRWEB) July 27, 2005 SMT manufacturers are facing increasingly complex challenges as they work to remove hazardous lead materials from the production of electronic packages. The effort, fueled by environmental considerations and governmental legislation, requires a thorough understanding of both the external impacts of the movement, as well as the equipment, process, and […]

Lead-Free Overview of SMT Manufacturing is Subject of Free, Live Web Seminar on Thurs., Aug. 18 at 11 AM, U.S. E.T. — Hosted by Speedline Technologies — Read More »

The HDPUG Guideline for Producing Pb Free Printed Circuit Assemblies

Scottsdale, AZ (PRWEB) April 26, 2010 Manufacturing products with Pb-Free solders has become an established practice following the introduction of legislation across Europe in 2006 in response to the European Union directive on the Restriction of Hazardous Substances (RoHS). The legislation outlaws the use of certain substances including lead (Pb) in the production of electrical

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