Materials

PARKER EXPANDS THERMAL INTERFACE MATERIALS OFFERING

PARKER EXPANDS THERMAL INTERFACE MATERIALS OFFERING

The Chomerics division of Parker Hannifin Corporation, the global leader in motion and control technologies, announced the launch of THERM-A-GAP GEL 75, a 7.5 W/m-K single component dispensable thermal interface material designed for high-performance applications. THERM-A-GAP GEL 75 is a single component, gel material best suited for today’s high-powered electronics applications. When applied to a heat-generating […]

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TDK INTRODUCES REVOLUTIONARY MEMS BASED CO2 GAS SENSOR PLATFORM

TDK INTRODUCES REVOLUTIONARY MEMS-BASED CO2 GAS SENSOR PLATFORM

TDK Corporation announces the InvenSense TCE-11101, a miniaturized ultra-low-power MEMS gas sensor platform for direct and accurate detection of CO2 in-home, automotive, IoT, healthcare, and other applications. The TCE-11101 introduces new technology that expands TDK’s sensor leadership into new applications and solutions, as part of the new SmartEnviroTM family. Its small size and low power enable consumer and commercial devices of

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110V 220V ELECTRIC MINI CIRCULAR SAW FOR HOUSEHOLD USE

110V/220V ELECTRIC MINI CIRCULAR SAW FOR HOUSEHOLD USE

There are many Mini Circular Saws available in the market, and it might be confusing getting one appropriate for you. I recently stumbled upon one of such saws, a 110V/220V Electric Mini Circular Saw. The circular saw is suitable for making straight cuts in wood, wood-like material, aluminum, plastic, and steel that has not undergone heat treatment. However, this

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NANO SANDWICHES IN ELECTRONICS SIGNIFICANTLY REDUCE RISK OF OVERHEATING

NANO-SANDWICHES IN ELECTRONICS SIGNIFICANTLY REDUCE RISK OF OVERHEATING

A new study about “Reduction of overheating of 2D materials” published in the Journal of Advanced Materials. The work put behind the study is credited to the researchers at the University of Illinois at Chicago College of Engineering. By joining together two-dimensional materials used in nanoelectronic devices between their three-dimensional silicon bases, they formed an ultrathin layer

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Rolling Meadows, IL — Best Launches Lead-Free Compatible PCB Repair Kits and Materials

(PRWEB) February 8, 2005 Advantages of this professional soldering kit include the inclusion of “how to” slides, the large number of replacement elements found in the circuit frames and the suitability of the materials for lead-free processing. These Best repair kits help soldering repair technicians become more proficient by offering a wide variety of tools

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Electrically Conductive Materials for Pad Printing Now Available from Creative Materials Inc.

Tyngsboro, MA (PRWEB) February 24, 2005 Creative Materials Inc., a leading manufacturer of electrically conductive inks, coatings and adhesives, has announced the availability of new electrically conductive materials for use in pad printing applications. Pad printing is an innovative printing technology that makes it possible to print on curved, uneven or recessed surfaces, while producing

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Creative Materials Feeds Advances in Touch Screen Manufacturing

(PRWEB) July 22, 2005 Tyngsboro, MA, (PRWEB) July 22, 2005 – The application team at Creative Materials, Inc., has introduced a family of three materials developed for printing on surfaces used in touch screen manufacturing. The use of touch screens has become prevalent in a wide variety of electronic applications: public information displays, retail

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Rohm and Haas Announces Leadership Changes in its Electronic Materials Business Group

PHILADELPHIA, Pennsylvania (Vocus) January 29, 2007 Rohm and Haas Company’s (NYSE:ROH) Electronic Materials business group, an innovator of advanced material solutions for the electronics industry, has announced several changes in its executive leaders. These moves, effective immediately, are associated with the company’s “Vision 2010” growth strategy and reorganization, which was announced in October 2006.  

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One of Nation’s Top Chemists to Address Students at 11th Annual Rohm and Haas Electronic Materials Invitational Science Fair

Freeport, NY (PRWEB) April 20, 2007 Dr. Ronald Breslow, professor of chemistry at Columbia University and a 1991 winner of the U.S. National Medal of Science, will deliver the keynote address at the 11th Annual Rohm and Haas Electronic Materials Invitational Science Fair on April 22, 2007, at Great Neck South High School, 341 Lakeville

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Advanced Electronics Materials Technologies: BizEsp launches OXFORD SOLDERS offering Solders, Solder Powders, Solder Pastes, Fluxes, Adhesives and BGA Spheres for Printed Circuit Board (PCB) Assembly

Oxford, United Kingdon (PRWEB) February 26, 2008 BizEsp Limited, “The Electronics Materials Specialists”, specialising in the application of fundamental sciences for advanced technology development and problem solving announced today the launch of its OXFORD SOLDERS brand in the China market for electronics assembly products. Product line up will include solder powders, solder pastes, fluxes and

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