Megapixel

OPEN Q 845 HDK DEVELOPMENT BOARD INTEGRATES SNAPDRAGON 845 SOC AND RUNS ANDROID 8.0

OPEN-Q 845 HDK DEVELOPMENT BOARD INTEGRATES SNAPDRAGON 845 SOC AND RUNS ANDROID 8.0

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Intrinsyc’s new Open-Q 845 HDK Development Kit has the same Mini-ITX (170 x 170mm) dimensions and sandwich-style design as the Open-Q 835 from the previous year. The main SoC, Snapdragon 845 is integrated into the board topped by a heatsink. This dev board includes a smartphone like 5.7-inch QHD (1440 x 2560) touchscreen controlled via MIPI-DSI, as well as a camera board […]

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Toshiba launches highly sensitive 20MP BSI CMOS image sensor

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Toshiba Corporation today announced that it will launch a new 20-megapixel (MP) CMOS image sensor, the TCM5115CL, as the latest addition to its sensor line-up for digital still cameras. TCM5115CL offers the industry’s highest resolution in the 1/2.3 inch optical format, using backside illumination technology (BSI) to improve sensitivity and imaging performance.

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Analog Devices’ Blackfin Powers Sigma’s New SD14, 14 Megapixel Digital Camera – Blackfin Performs up to 200 Computations Per Pixel for Every Image in Pipeline from Sensor to Memory Card

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Norwood, MA (PRWEB) June 26, 2007 Analog Devices, Inc. (NYSE: ADI) today announced that Sigma Corporation selected Analog Devices’ Blackfin processor for its SD14 digital single lens reflex (SLR) camera. Powered by the unique direct-image capabilities of the Foveon X3 sensor and a Blackfin ADSP-BF561 processor, the SD14 can reproduce high-definition images rich in gradation

Analog Devices’ Blackfin Powers Sigma’s New SD14, 14 Megapixel Digital Camera – Blackfin Performs up to 200 Computations Per Pixel for Every Image in Pipeline from Sensor to Memory Card Read More »

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