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FUJITSU SEMICONDUCTOR RELEASES WORLD’S LARGEST DENSITY 8MBIT RERAM PRODUCT FROM SEPTEMBER

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Featuring memory with the industry’s smallest read current, optimal for small wearable devices Fujitsu Semiconductor announced the release of the 8 Mbit ReRAM MB85AS8MT, which has the world’s largest density as a mass-produced ReRAM product, available from September 2019. This ReRAM product was jointly developed with Panasonic Semiconductor Solutions Co.. The MB85AS8MT is an EEPROM-compatible non-volatile memory with SPI-interface that operates with […]

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AI COMPUTE ACCELERATION STARTUP BUILDS THE LARGEST CHIP EVER FOR DEEP LEARNING APPLICATIONS

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To meet the ever-increasing computational demands of AI, California based AI startup, Cerebras Systems, just recently unveiled its very first announced element claimed to be the most massive AI chip ever made. With an astounding measurement of 46,225 mm2 (up to 56.7 times more than the largest graphics processing unit) and more than 1.2 trillion transistors, the Wafer-Scale Engine

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WORLD’S LARGEST FPGA BOASTS 9 MILLION SYSTEM LOGIC CELLS

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Xilinx has expanded its 16nm Virtex UltraScale+ family to include what it claims to be the world’s largest FPGA, the Virtex UltraScale+ VU19P. By Julien Happich @ www.eenewseurope.com With 35 billion transistors, the VU19P provides the highest logic density and I/O count on a single device ever built, enabling emulation and prototyping of tomorrow’s most advanced

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TAKE CONTROL OF YOUR PROJECT WITH COM-CFHB6

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AAEON, an industry leader in embedded computing, announces the COM-CFHB6 Computer-on-Module. Featuring the 8th and 9th Generation Intel Core Processors, it is built to bring flexible computing to any embedded project. The COM-CFHB6 is built to the COM Express Type 6 form factor. It features a wide range of processors from the Intel Celeron to Intel Xeon, and the 8th

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IWAVE SYSTEMS LAUNCH HIGH-PERFORMANCE ARINC 818-2 VIDEO PROTOCOL ANALYZER

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iWave Systems, a leading FPGA design house based in Bangalore has announced the launch of the ARINC 818-2 high-performance Video Protocol Analyzer for processing and analyzing the ADVB frames generated by any ARINC 818-2 based systems. ARINC 818 Avionics Digital Video Bus (ADVB) is used as a video transport protocol for high bandwidth, low latency, uncompressed digital

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APOLLO LAKE PICO-ITX SBC SUPPLIES MINI-PCIE AND M.2 EXPANSION

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Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is pleased to introduce the PICO319, a low power yet powerful fanless Pico-ITX SBC powered by the onboard Intel® Atom® x5-E3940 quad-core processor (code name: Apollo Lake). The noise-free pico-ITX motherboard

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ASDM-S-KBU: BRING THE EDGE TO SMART DISPLAY SOLUTIONS

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AAEON, an industry leader in embedded solutions, announces the ASDM-S-KBU, the only Intel SDM Small (SDM-S) module featuring 7th Generation Intel Core processors (formerly Kaby Lake). The ASDM-S-KBU offers unparalleled computing power for its compact size, capable of powering AI Edge applications. The ASDM-S-KBU brings the high performance of Intel Core processors to the compact Intel

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GREENLIANT DELIVERS ULTRA-FAST SPEEDS WITH NVME M.2 ARMOURDRIVE SSDS

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Greenliant has started sampling its NVMe M.2 ArmourDrive™ solid state drive (SSD) modules to customers requiring high-performance, high-capacity removable data storage that can withstand extreme environments. The new industrial temperature (-40°C to +85°C) 88 PX Series NVMe M.2 ArmourDrive SSDs use 3-bits-per-cell (TLC) 3D NAND flash memory and are built in the widely used 2242 and

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NEW KONTRON SMARC-SXAL4 (E2) MODULE WITH UP TO 8 GBYTE LPDDR4 MEMORY DOWN

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Kontron, a leading global provider in IoT/Embedded Computer Technology (ECT), has introduced the new SMARC-sXAL4 module. The module is available with either Intel Atom®, Intel® Pentium® or Intel®Celeron® processors of the latest generation. With dimensions of only 82mm x 50mm, it can be used flexibly, and the E2 version is designed for use in an extended temperature range from

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TOSHIBA LAUNCHES NEW FAMILY OF LOW VOLTAGE DRIVEN PHOTORELAYS

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Toshiba Electronics Europe GmbH, the industry leader in the miniaturisation of cutting-edge photorelays, introduced a new family of five photorelays housed in one of the industry’s smallest package. The new devices are suited for use in automatic test equipment, memory testers, SoC/LSI testers and probe cards. Both TLP34xxSRL devices and all three of the TLP34xxSRH series have input voltage

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