HDP User Group Launches Application Guidelines for Board Mounted Power Supplies
Scottsdale, AZ (PRWEB) March 27, 2007 The High Density Packaging (HDP) User Group announces the launch of the industrys first Board Mounted Power Supply (BMPS) Application Guidelines. The 148-page document is designed to support the communications and electronics manufacturing industry by promoting understanding of BMPS products. Originally started as a project within the Power Sources […]
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