Fujitsu Develops World's First Eight-Stacked Multi-Chip Package

(PRWEB) May 15, 2002 Fujitsu Microelectronics has announced the development of an ultra-high density, multi-chip package (MCP) that can support up to eight chips. This development was made possible by the company’s advances in thin chip processing and multi-stacked package technology. Thin chip processing is a special wafer-support technology that permits chips to be […]

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