Pads

Exploring Eagle CAD ULPs #3 – Teardrops.ULP Make A Teardrop Shape Connection With Pads and Vias

Welcome to the third post of the “Exploring Eagle CAD ULPs” series. Every week we will publish a new post about one useful ULP in Eagle CAD. “ULP” User Language Program is a plain text file which is written in a C­-like syntax and can be used to access the EAGLE data structures and to […]

Exploring Eagle CAD ULPs #3 – Teardrops.ULP Make A Teardrop Shape Connection With Pads and Vias Read More »

Rohm and Haas Gains Strong Market Traction with Defect and Slurry Reduction Groove Designs for CMP Pads : Products in Testing and Manufacturing in Leading-Edge, High Volume Fabs Worldwide

HSINCHU, Taiwan (PRWEB) September 10, 2008 Rohm and Haas’s defect reduction groove has already been adopted in high volume manufacturing (HVM) by customers in Europe, Korea, North America and Taiwan. While currently being used on the Rohm and Haas IC1000 AT CMP pad for the 90 nm process node and below, multiple customers are now

Rohm and Haas Gains Strong Market Traction with Defect and Slurry Reduction Groove Designs for CMP Pads : Products in Testing and Manufacturing in Leading-Edge, High Volume Fabs Worldwide Read More »

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