EXTREMELY SMALL POWER-SAVING 3D MAGNETIC SENSOR OPENS UP NEW DESIGN OPTIONS
Infineon Technologies AG will expand its XENSIV™ 3D magnetic sensor family TLx493D. At its in-house digital trade show “Virtual Sensor Experience”, the chipmaker will present a new device for industrial and consumer applications: the TLI493D-W2BW. It uses the latest 3D Hall generation from Infineon and is housed in an extremely small wafer-level package. With an 87 percent smaller footprint and […]
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