Processor

PH12FEI – THIN MINI ITX BOARD WITH COFFEE LAKE CPU

PH12FEI – THIN MINI-ITX BOARD WITH COFFEE LAKE CPU

Thin Mini-ITX Mainboard for compact display systems With the Thin Mini-ITX Board PH12FEI, ICP Deutschland offers system integrators a motherboard to produce particularly flat displays or embedded systems. The PH12FEI is equipped with an IO Shield at half height and horizontal memory slots, which bring it to a height of only 20 mm. The LGA1151 socket installed

PH12FEI – THIN MINI-ITX BOARD WITH COFFEE LAKE CPU Read More »

TINY COMPUTE MODULES FEATURES SNAPDRAGON 845 AND SNAPDRAGON 660

TINY COMPUTE MODULES FEATURES SNAPDRAGON 845 AND SNAPDRAGON 660

A production ready micro SoM based on Snapdragon™ 845 SoC architected for Artificial Intelligence and Immersion The compact sized Inforce 67X1 SOM’s multiple MIPI-CSI interfaces and on-device artificial intelligence (AI) allows users to capture cinema-grade videos and blur the lines between physical and virtual worlds. The product’s enhanced hardware and software capabilities bring high-performance, true-to-life

TINY COMPUTE MODULES FEATURES SNAPDRAGON 845 AND SNAPDRAGON 660 Read More »

IBASE RELEASES MINI ITX MOTHERBOARD POWERED BY 9TH 8TH GEN INTEL PROCESSORS

IBASE RELEASES MINI-ITX MOTHERBOARD POWERED BY 9TH/8TH GEN INTEL PROCESSORS

iBASE Technology, a manufacturer of application specific industrial embedded computing platforms, has released the MI998 Mini-ITX motherboard supporting 9th/8th Gen Intel® Xeon® E / Core™ / Pentium® / Celeron® processors with a maximum of 4.7GHz frequency with Intel® Turbo Boost Technology. Equipped with the Intel C246/Q370/H310 chipset, this cutting-edge platform offers the required trusted performance

IBASE RELEASES MINI-ITX MOTHERBOARD POWERED BY 9TH/8TH GEN INTEL PROCESSORS Read More »

MEMS BASED “SONAR ON A SILICON CHIP” ULTRASONIC TIME OF FLIGHT SENSORS

MEMS-BASED “SONAR ON A SILICON CHIP” ULTRASONIC TIME-OF-FLIGHT SENSORS

TDK Corporation’s announces the immediate worldwide availability of the Chirp CH-101 MEMS-based ultrasonic Time-of-Flight (ToF) sensor. This ToF sensor utilizes a tiny ultrasonic transducer chip to send out a pulse of ultrasound and then listen for echoes returning from targets in the sensor’s field-of-view. By calculating the ToF, the sensor can determine the location of

MEMS-BASED “SONAR ON A SILICON CHIP” ULTRASONIC TIME-OF-FLIGHT SENSORS Read More »

NXP SEMICONDUCTORS MPC5777C POWER ARCHITECTURE® MICROCONTROLLER

NXP SEMICONDUCTORS MPC5777C POWER ARCHITECTURE® MICROCONTROLLER

NXP Semiconductors MPC5777C Power Architecture® Microcontroller is a high-performance, multicore MCU optimized for industrial and automotive control applications that require advanced performance, timing systems, security, and functional safety capabilities. The MPC5777C features two independent Power Architecture z7 cores with up to 300MHz operation, along with a single z7 core in Lockstep with one of the main cores.

NXP SEMICONDUCTORS MPC5777C POWER ARCHITECTURE® MICROCONTROLLER Read More »

SOLIDRUN HONEYCOMB LX2K RUNS LINUX ON NXP’S 16 CORE A72 LX2160A

SOLIDRUN HONEYCOMB LX2K RUNS LINUX ON NXP’S 16-CORE -A72 LX2160A

SolidRun has announced pre-sales for $550 for its developer-oriented “early access” edition of a high-end networking board that features NXP’s 16-core, Cortex-A72 LX2160A. The beta-stage HoneyComb LX2K early version board will ship in September, and the $750 model with extra features will go on sale in October 2019. The HoneyComb LX2K is a sandwich-style board designed based on a COM Express Type 7 module, and it’s equipped with 2x 10GbE SFP+

SOLIDRUN HONEYCOMB LX2K RUNS LINUX ON NXP’S 16-CORE -A72 LX2160A Read More »

CONGATEC BOARDS WITH 8TH GEN INTEL® CORE™ MOBILE PROCESSOR AND 10 YEARS AVAILABILITY

CONGATEC BOARDS WITH 8TH GEN INTEL® CORE™ MOBILE PROCESSOR AND 10+ YEARS AVAILABILITY

Congatec, a leading vendor of standardized and customized embedded computer boards and modules, announced today that the brand new embedded versions of the 8th Generation Intel® Core™ Mobile processors (codenamed Whiskey Lake) are now available on COM Express Type 6 Compact modules, 3.5 inch SBCs, and Thin Mini-ITX motherboards. OEM customers benefit from an instant performance boost of up

CONGATEC BOARDS WITH 8TH GEN INTEL® CORE™ MOBILE PROCESSOR AND 10+ YEARS AVAILABILITY Read More »

INTRINSYC ANNOUNCES IMMEDIATE AVAILABILITY OF THE OPEN Q™ 820PRO HIGH PERFORMANCE SYSTEM ON MODULE

INTRINSYC ANNOUNCES IMMEDIATE AVAILABILITY OF THE OPEN-Q™ 820PRO HIGH-PERFORMANCE SYSTEM ON MODULE

High-performance edge computing module for use in a variety of consumer and industrial IoT Devices Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the availability of the Open-Q™ 820Pro µSOM (micro System on Module) and Development Kit. Intrinsyc’s Open-Q™ 820Pro

INTRINSYC ANNOUNCES IMMEDIATE AVAILABILITY OF THE OPEN-Q™ 820PRO HIGH-PERFORMANCE SYSTEM ON MODULE Read More »

Scroll to Top