MEMtronics Receives Phase 2 Award for DARPA RF MEMS Switch Development – Company’s technology increases environmental robustness of wireless systems
(PRWEB) May 5, 2005 Part of the Harsh Environment Robust Micromechanical Technology (HERMIT) Program, the first phase of this contract recently culminated in the successful demonstration of a wafer-level packaging technology called wafer-level microencapsulation. This packaging scheme protects MEMS switches from the adverse effects of moisture and particles. The microfabricated packages have extremely low loss […]