Reduce IC Packaging Costs with Screen-Printable B-Stage Epoxy
Tyngsboro, MA (PRWEB) September 9, 2005 The application team at Creative Materials, Inc., has introduced a screen-printable, b-stageable, highly thermally conductive epoxy adhesive for integrated circuit (IC) packaging. This material is designed to increase product performance through the use of b-staging, while reducing manufacturing costs through screen-printing. Creative Materials 122-07(SP) features excellent thermal stability, outstanding […]
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