Rohm and Haas Unveils New ACuPLANE Copper Barrier CMP Solution : Pad and Slurry Combo Achieves Controllable Process with Reduced Defectivity and COO
HSINCHU, Taiwan (PRWEB) September 10, 2008 By optimizing the performance of the pad and slurry combination, the ACuPLANE system can achieve an order of magnitude in defectivity reduction, while giving customers higher levels of control to minimize metal and dielectric loss. Additionally, the ACuPLANE system can significantly minimize post-polish topography across the wafer, and reduce […]