Substrates

The Demand for Increased Functionality, Improved Signal Integrity and Interconnect Density is Driving the Requirement for Flexible and Flex-Rigid Substrates

Dublin (PRWEB) October 17, 2005 Research and Markets (http://www.researchandmarkets.com/reports/c25862) has announced the addition of Flexible and Flex-Rigid Printed Circuits 2005 – A Global Market and Technology Review 2004-2010 to their offering   This study provides a totally integrated assessment of the global flexible and flex-rigid substrate supply chain. Issues relating to technology, markets and strategic […]

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HDP User Group Initiates Integrated Circuit Attachment to Printed Electronics Substrates Project

Paradise Valley, AZ (PRWEB) February 2, 2011 The High Density Packaging User Group International, Inc. (HDP User Group), a global non-profit cooperative research and development organization for the Electronics Manufacturing industries, announces the start of a new project group focusing on printed electronics. At this time the project is in the idea stage and open

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