Technology

NPC 1210 SERIES LOW MEDIUM PRESSURE SENSORS

NPC-1210 SERIES LOW/MEDIUM PRESSURE SENSORS

Amphenol’s pressure sensors provide flexibility in low-profile applications where pressure connection orientation is critical Amphenol NovaSensor’s NPC-1210 series of low/medium pressure sensors provides a cost-effective solution for applications that require calibrated performance over a wide temperature range. Packaged in a dual-in-line configuration, the NPC-1210 series is intended for printed circuit board mounting. Optional pressure port and lead […]

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BROADCOMS BCM4389 CHIP WITH WI FI 6E TECHNOLOGY AND BLUETOOTH 5

BROADCOM’S BCM4389 CHIP WITH WI-FI 6E TECHNOLOGY AND BLUETOOTH 5

Broadcom’s BCM4389 chip is a client-side device supporting Wi-Fi 6E and Bluetooth 5 combo dedicated to mobile handset applications. The Wi-Fi 6E technology can operate on the 6 GHz band with 160MHz wide channels which is a progressive version of the Wi-Fi 6 technology. Hence, it enables speeds over 2 Gbps for faster communications than the Wi-Fi 6 that supports from 2.4GHz to 5GHz radio bands.

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TEXAS INSTRUMENTS ANTENNA ON PACKAGE MMWAVE SENSOR

TEXAS INSTRUMENTS’ ANTENNA-ON-PACKAGE MMWAVE SENSOR

Radar sensors are not exactly a new thing, but, like every other technology, there is always progress to be made, something that could be improved in order to take the technology to the next level. One of its younger cousins, the mmWave technology, which you may have not heard of until this point, is a promising category

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UOLED 128 G2 – 1.5″ SMART MICRO OLED DISPLAY

UOLED-128-G2 – 1.5″ SMART MICRO OLED DISPLAY

The uOLED-128G2 is a compact and cost effective display module using the latest state of the art Passive Matrix OLED (PMOLED) technology with an embedded GOLDELOX graphics processor that delivers ‘stand-alone’ functionality to any project. Powerful graphics, text, image, animation and countless more features are built inside the GOLDELOX chip. The module is designed to work out

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SUPERIOR SENSOR TECHNOLOGY HV DIFFERENTIAL LOW PRESSURE SENSORS

SUPERIOR SENSOR TECHNOLOGY HV DIFFERENTIAL LOW-PRESSURE SENSORS

Superior Sensor Technology HV Differential Low-Pressure Sensors targets pressure ranges from as low as 0.1″ inH2O (Water Column) to 60″ inH2O with industry-leading 16-bits of resolution for each range supported. With the Multi‐Range capability enabled, optimal performance is maintained from 60″ inH2O down to even 0.1″ inH2O. The HV family employs Superior’s proprietary NimbleSense™ architecture that

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KEMET ADVANCES HYBRID ALUMINUM POLYMER CAPACITOR TECHNOLOGY

KEMET ADVANCES HYBRID ALUMINUM POLYMER CAPACITOR TECHNOLOGY

KEMET, a subsidiary of Yageo Corporation (“Yageo”) (TAIEX: 2327) and leading global supplier of electronic components, announces the launch of three hybrid aluminum polymer capacitor series: A780, PHA225, and PHH225. These AEC-Q200 qualified capacitors offer a combination of highly conductive polymer technology and liquid electrolytic material in a hybrid design, resulting in an outstanding electrical

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NEW LIGHT POWERED AI CHIP TRIES TO MIMIC HUMAN BRAIN

NEW LIGHT-POWERED AI CHIP TRIES TO MIMIC HUMAN BRAIN

Researchers at RMIT University have developed a new kind of artificial intelligence technology that works by imitating the way a human brain processes visual information. It promises to bring together imaging, processing, machine learning, and memory in one single electronic chip powered by light. This nanoscale advancement links the core software needed to drive artificial intelligence with image-capturing hardware in a

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BROADCOMS SINGLE SILICON PHOTO MULTIPLIER IS BEST SUITED FOR THE DETECTION OF LOW LEVEL PULSED LIGHT SOURCES

BROADCOM’S SINGLE-SILICON PHOTO-MULTIPLIER IS BEST SUITED FOR THE DETECTION OF LOW-LEVEL PULSED LIGHT SOURCES

The Broadcom® AFBR-S4N33C013 is a single-silicon photo-multiplier (SiPM) used for ultra-sensitive precision measurement of single photons. The active area is 3.0 mm × 3.0 mm. A high packing density of single chips is achieved using through-silicon-via (TSV) technology and a chip-sized package (CSP). Larger areas can be covered by tiling multiple AFBR-S4N33C013 CSPs almost without any edge losses. The

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