Technic Releases New Tin-Silver Alloy Electroplating Process: Technistan Ag
Cranston, RI (PRWEB) October 15, 2009 Technic has announced the release of Technistan Ag, a new, patent pending, high speed tin-silver alloy electroplating process for use in electronic connector and component applications. Technistan Ag is designed to produce a 95% tin / 5% silver bright electrodeposit at current densities of up to 300 amps per […]
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