TransDimension and Chipidea Host Webinar on Simplifying the Integration of High-Speed USB

Irvine, CA (PRWEB) June 15, 2005

TransDimension, the leader in USB connectivity solutions for embedded applications, will join with Chipidea, the leading analog and mixed-signal semiconductor solutions provider, to present a webcast titled, “Simplifying the Integration of High-Speed USB Into Your SoC,” on Wednesday, June 22 at 2:00 p.m. Eastern.


Experts from TransDimension and Chipidea will share insights on how SoC manufacturers can get around incompatible IP blocks and design USB into a SoC in a matter of weeks, as well as deliver practical advice based on real deployments. The seminar will address the three key elements of the TransDimension and Chipidea combined solution: the physical layer (PHY), the controller and the software.


TransDimension and Chipidea offer the only complete USB high-speed SoC solution on the market. While other companies offer both PHY and controller, only TransDimension


and Chipidea also provide the software required to implement USB in the embedded system. The unique differentiator in this offering is the comprehensive software provided by TransDimension. Other competitive solutions are lacking in scope as PHY, controller IP and software are provided by different vendors. The challenge is in interoperability and the outcome is months of design work to address the multiple issues inherent in attempting to make multiple vendor IP blocks work together.


This valuable one-hour online seminar will focus on how the cooperative solution from TransDimension and Chipidea can dramatically reduce implementation time and time-to-market. Topics of discussion include the challenges associated with using separate vendors, typical problems faced by SoC manufacturers and the benefits of a single source solution. Presenters will share a comparison study that explores an IP implementation and proves the benefits realized with a complete, single source solution.


Featured presenters include Milton Sousa, Chipidea business development manager and semiconductor research, design and marketing expert, John Cassidento, TransDimension manager of IP marketing and 15 year veteran of integrated circuits and intellectual property sales and support and Jim Gilbert, TransDimension director of software marketing and embedded USB software solutions expert.


Who should participate? This informative webcast should be attended by system architects/designers, chip designers, engineering development managers and program/project managers for fabless semiconductor companies developing SoCs for consumer electronics applications.


Registration is limited for this free, one-hour online seminar. Online registration and additional seminar details can be found at: or


About Chipidea


Chipidea is the world’s number one analog/mixed-signal merchant technology supplier targeting fast-growing market segments like wireless communications, digital media


and consumer electronics. Chipidea supports blue-chip customers across the globe, has an impeccable reputation for delivering high-quality products and is known for its reliable execution. Chipidea licenses its technology to leading companies in these and other key markets, delivering everything from precision single-function blocks to full analog sub-systems. Chipidea employs 180 people in its research and development, and sales and marketing offices across Europe, Asia and North America.


About TransDimension


Headquartered in Irvine, California, TransDimension is a privately held company founded in 1997 to develop and market connectivity solutions. TransDimension’s product lines include the integrated circuits, IP cores and USB software stacks that enable wired and wireless connectivity between a wide range of PC peripheral, consumer electronic and mobile device applications. TransDimension’s SoftConnex USB solutions provide the broadest operating system and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension can be found at


Media Contact:


Jennifer Tolkachev


Lages & Associates




[email protected]


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About The Author

Ibrar Ayyub

I am an experienced technical writer holding a Master's degree in computer science from BZU Multan, Pakistan University. With a background spanning various industries, particularly in home automation and engineering, I have honed my skills in crafting clear and concise content. Proficient in leveraging infographics and diagrams, I strive to simplify complex concepts for readers. My strength lies in thorough research and presenting information in a structured and logical format.

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