TransDimension and Chipidea Host Webinar on Simplifying the Integration of High-Speed USB
Irvine, CA (PRWEB) June 15, 2005 TransDimension, the leader in USB connectivity solutions for embedded applications, will join with Chipidea, the leading analog and mixed-signal semiconductor solutions provider, to present a webcast titled, Simplifying the Integration of High-Speed USB Into Your SoC, on Wednesday, June 22 at 2:00 p.m. Eastern. Experts from TransDimension and […]