Frenchtown, NJ (PRWEB) August 28, 2005
Aries Electronics, Inc., an international manufacturer of standard, programmed and custom interconnection products, has announced that new test measurements for its Center Probe test sockets show a 30% improvement in bandwidth over earlier tests.
The new measurements, from the well-known independent test lab GateWave Northern, Inc., were taken from a 5.0 mm sq. MLF/QFN package, with pads on a 0.50 mm pitch. The Center Probe test sockets accommodate pitches as small as 0.50 mm and apply PCB preload when mounted.
When measured for time, the test socket had a signal delay of 15.0 ps (pico seconds), an open circuit rise time of less than 34.5 ps, a short circuit rise time of less than 30.0 ps, and a rise time through 50 of less than 31.5 ps. When measured for frequency, the Center Probe had an insertion loss of less than 1 dB to 18.5 GHz , less than 3 dB to 39.7 GHz and VSWR (voltage standing wave ratio) of less than 2 :1 to 38.3 GHz.
The test lab also measured equivalent circuit parameters: pin inductance was 0.59 nH; pin-to-ground capacitance was 0.31 pF; mutual inductance was 0.338 nH; mutual capacitance was 0.12 pF; transmission line impedance was 44.9 ; and the electrical length of the line model was 15.0 ps. During the test, the signal path was only 1.95 mm and total probe movement was 0.584mm.
All Aries sockets are available in custom materials, platings, sizes and configurations to suit specific customer applications.
Pricing for a 20 lead MLF socket starts at $ 365 each for one to four pieces. Delivery is six weeks ARO.
For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown,
NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891;
Web: http://www.arieselec.com,
Europe contact Tel: +44 870 240 0249
Reader service inquiries: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825.
Editors note: Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip product line of “intelligent connectors”; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.
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