Experts to Explore Lead Free Manufacturing Process Challenges in Free, Live Webcast Seminar – Thursday, Feb. 17th – 11 a.m. to Noon, U.S. E.T.

FRANKLIN, MA (PRWEB) January 25, 2005

SMT manufacturing experts will explore the day’s leading lead free SMT manufacturing process challenges in a free, live webcast seminar set for Thursday, Feb. 17, 2005 at 11 am, U.S. Eastern Time.

The one-hour webinar, to be presented by Speedline Technologies, will focus on the electronics industry’s move to lead-free assemblies. Process issues abound throughout the industry as companies begin removing hazardous lead from electronic packages and reducing the dependency on lead materials that can leach into the environment during processing or disposal. The effort is global and is driven by environmental considerations, governmental legislation, and the marketing advantages of lead-free electronic packages.

Hosted by experts who have been developing and implementing manufacturing techniques for more than 20 years, the interactive webinar will feature live discussions of process challenges, new technologies, and how-to implementation information – as well as participant questions and answers.

Participation is as easy as visiting a website and dialing into a toll-free telephone number. Topics will include:

About The Author

Ibrar Ayyub

I am an experienced technical writer holding a Master's degree in computer science from BZU Multan, Pakistan University. With a background spanning various industries, particularly in home automation and engineering, I have honed my skills in crafting clear and concise content. Proficient in leveraging infographics and diagrams, I strive to simplify complex concepts for readers. My strength lies in thorough research and presenting information in a structured and logical format.

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