Fujitsu Introduces High-Density 4X I/O Connector Module for Space-Efficient, High-Speed Signal Transmission

Summary of Fujitsu Introduces High-Density 4X I/O Connector Module for Space-Efficient, High-Speed Signal Transmission


Fujitsu Components America released the FCN-268Y032-A, a compact 4x I/O connector module supporting high-speed data rates like InfiniBand and 10G Fiber Channel. This stacked module increases port density while simplifying routing on motherboards. It features a robust die-cast housing for EMI protection and uses a single board-to-board interface to reduce component count.

Parts used in the Multi-IO microGiGaCN Series:

  • FCN-268Y032-A 2x2-stacked module
  • Fujitsu high-speed board-to-board mezzanine connector
  • Die-cast housing
  • Link-status LEDs (planned option)
  • Media detect circuitry (planned option)

Sunnyvale, CA (PRWEB) April 28, 2006

Fujitsu Components America, Inc. today released the first in a series of new connector modules for 4x I/O to support high-speed signal transmission. The new modules offer a compact, cost-efficient way to increase I/O port density and available printed circuit board (pcb) space, while simplifying high-speed signal routing on the main pcb.

 

The first module in Fujitsus Multi-IO microGiGaCN series is the FCN-268Y032-A. This is a 2×2-stacked module of four, 4x links that meets InfiniBand, InfiniBand DDR, 10G Fiber Channel, and 10GBase-CX4 data rates in a 4-channel, bi-directional data-transfer mode. The module is designed to accommodate up to five modules (20 links) installed in a 1U configuration on a motherboard.

 

Each 2×2 module mounts to the pcb via a single, Fujitsu high-speed, board-to-board mezzanine connector, which is rated to 10Gbps. Using only a single interface connector per module simplifies board design and reduces component count on the pcb. In addition, the modules die-cast housing offers a robust, mechanical interface and improved EMI protection. Options for link-status LEDs and media detect circuitry are planned on future versions.

 

The FCN-268Y032-A has a 30VAC rating and 240m ohm contact resistance (signal), 180m ohms (ground). When mated, it has a differential characteristic impedance of 100 ohms +/-10 percent with 100ps rise time.

 

The FCN-268Y032-A is priced at $ 37.50 in 1K quantities. The high-speed interface connector is priced at $ 7.39 in 1K quantities.

 

Company Information

 

Fujitsu Components America Inc. markets and distributes electronic components throughout North, Central and South America. Products include relays, connectors, keyboards, touch panels, pointing and input devices, KVM switches and thermal printer mechanisms. The company is headquartered at 250 E. Caribbean Drive, Sunnyvale, California, 94089. For product information, contact FCAI via telephone at 1-800-380-0059.

 

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Quick Solutions to Questions related to Multi-IO microGiGaCN Series:

  • What data rates does the FCN-268Y032-A support?
    The module meets InfiniBand, InfiniBand DDR, 10G Fiber Channel, and 10GBase-CX4 data rates.
  • How many modules can be installed in a 1U configuration?
    Up to five modules can be installed in a 1U configuration on a motherboard.
  • Does the module use multiple connectors per unit?
    No, each module mounts via a single Fujitsu high-speed board-to-board mezzanine connector.
  • What is the differential characteristic impedance of the connector?
    The differential characteristic impedance is 100 ohms +/-10 percent.
  • Can the module handle 30VAC?
    Yes, the FCN-268Y032-A has a 30VAC rating.
  • What is the price of the module in 1K quantities?
    The module is priced at $37.50 in 1K quantities.
  • Is there an option for link-status indicators?
    Options for link-status LEDs are planned on future versions.
  • What is the contact resistance for ground connections?
    The contact resistance for ground is 180m ohms.

About The Author

Ibrar Ayyub

I am an experienced technical writer holding a Master's degree in computer science from BZU Multan, Pakistan University. With a background spanning various industries, particularly in home automation and engineering, I have honed my skills in crafting clear and concise content. Proficient in leveraging infographics and diagrams, I strive to simplify complex concepts for readers. My strength lies in thorough research and presenting information in a structured and logical format.

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