Scottsdale AZ (PRWEB) April 13, 2006
The Board of Directors for the High Density Packaging User Group International, Inc. (HDP), a global non-profit cooperative research and development organization for the Telecommunications and Computer industries, announced that Marshall Andrews will join HDP as Executive Director. Mr. Andrews succeeds Ruben Bergman, the previous Executive Director and founder of the association. Mr. Bergman, has directed the association for the past 12 years, and will remain as Marketing Director, reporting to Mr. Andrews.
The Board would like to express its appreciation to Mr. Bergman for his outstanding service in the past, and we look forward to his continued assistance as Marketing Director. Stated Michael Kluwin of Juniper Networks, Chairman of the Board. Mr. Andrews brings a wealth of experience in cooperative organizations, and the Board and I are excited about working with him to move HDP forward. Ruben Bergman commented: I am pleased that Marshall will be managing the HDP User Group through the next phase of activity. I have known Marshall professionally for over 10 years, both when he was at MCC and at ITRI.
Mr. Andrews prepared the original plan for the highly successful Electronic Packaging Program within the Microelectronics and Computer Technology Corporation (MCC), the first large consortia in the North American Electronics industry, and worked on the program in Austin Texas for 12 years. He then formed and directed The Interconnect Technology Research Institute (ITRI) a cooperative research association for the North American Printed Wiring Board industry for 6 years. HDP has a strong core of key company members, and dedicated participants. Their international presence gives them a unique ability to address the technical problems facing the electronics industry today, Mr. Andrews said. I look forward to helping the organization expand its technical program and member base.
About the HDP User Group International Inc.
HDP User Group (http://www.hdpug.org) is a global research and development organization based in Scottsdale AZ, dedicated to reducing the costs and risks for the Telecommunications and Computer industries when using advanced electronic packaging and assembly. This international industry led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP maintains additional offices in Austin, TX.; Stockholm, Sweden; and Tokyo, Japan.
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