HIGH DENSITY ROBUST SSD OFFERS DENSITIES UP TO 1TB IN A 16×20 MM BGA

Micron has officially launched the Micron 2100AI/AT– an industrial- and automotive-grade PCIe NVMe Industrial SSD family based on 64-layer triple-level cell (TLC) 3D NAND technology. Available in 64GB-1TB BGA and 256GB-1TB M.2 form factors, the new 2100AI/AT series is Micron’s first offering with a PCIe interface supporting the NVMe protocol that is designed to address the needs of the industrial segment: longevity, reliability, quality, ruggedness, and application-specific features such as namespace, autonomous power transitions, and boot emulation.

HIGH DENSITY ROBUST SSD OFFERS DENSITIES UP TO 1TB IN A 16×20 MM BGA

These SSDs are ideally suited for the Aerospace and Defence market combining an extended temperature range and robust data protection features, along with Micron’s long-term product commitment and customer collaboration, creates a design that stands apart from the competition.

Designs that require high endurance can take advantage of application-specific features provided by these PCIe NVMe SSDs, such as namespace. With the namespace feature, a portion of the SSD (or the entire SSD) can be converted to SLC mode.

In addition to having a removable M.2 form factor, the BGA form factor offers a highly ruggedized solution for industrial applications—providing up to 1TB of storage space. Systems requiring greater than 1TB can utilize multiples of these devices to take advantage of the 16mm x 20mm package size.

Read more: HIGH DENSITY ROBUST SSD OFFERS DENSITIES UP TO 1TB IN A 16×20 MM BGA


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