Summary of HIGH DENSITY ROBUST SSD OFFERS DENSITIES UP TO 1TB IN A 16×20 MM BGA
Micron launched the 2100AI/AT, an industrial and automotive-grade PCIe NVMe SSD family using 64-layer TLC 3D NAND. Available in BGA and M.2 form factors ranging from 64GB to 1TB, these drives target aerospace, defense, and high-endurance applications. Key features include extended temperature ranges, robust data protection, namespace support for SLC conversion, autonomous power transitions, and boot emulation. The rugged BGA package measures 16mm x 20mm, while the removable M.2 offers flexible integration.
Parts used in the Micron 2100AI/AT:
- PCIe NVMe Industrial SSD
- 64-layer triple-level cell (TLC) 3D NAND technology
- BGA form factor
- M.2 form factor
- Namespace feature
- Autonomous power transitions
- Boot emulation
Micron has officially launched the Micron 2100AI/AT– an industrial- and automotive-grade PCIe NVMe Industrial SSD family based on 64-layer triple-level cell (TLC) 3D NAND technology. Available in 64GB-1TB BGA and 256GB-1TB M.2 form factors, the new 2100AI/AT series is Micron’s first offering with a PCIe interface supporting the NVMe protocol that is designed to address the needs of the industrial segment: longevity, reliability, quality, ruggedness, and application-specific features such as namespace, autonomous power transitions, and boot emulation.
These SSDs are ideally suited for the Aerospace and Defence market combining an extended temperature range and robust data protection features, along with Micron’s long-term product commitment and customer collaboration, creates a design that stands apart from the competition.
Designs that require high endurance can take advantage of application-specific features provided by these PCIe NVMe SSDs, such as namespace. With the namespace feature, a portion of the SSD (or the entire SSD) can be converted to SLC mode.
In addition to having a removable M.2 form factor, the BGA form factor offers a highly ruggedized solution for industrial applications—providing up to 1TB of storage space. Systems requiring greater than 1TB can utilize multiples of these devices to take advantage of the 16mm x 20mm package size.
Read more: HIGH DENSITY ROBUST SSD OFFERS DENSITIES UP TO 1TB IN A 16×20 MM BGA
- What is the storage capacity range of the Micron 2100AI/AT series?
The series is available in capacities ranging from 64GB to 1TB. - Does the Micron 2100AI/AT support the NVMe protocol?
Yes, it is the first offering with a PCIe interface supporting the NVMe protocol. - Can users convert part of the SSD to SLC mode?
Yes, the namespace feature allows a portion or the entire SSD to be converted to SLC mode. - What are the physical dimensions of the BGA form factor?
The BGA form factor offers a package size of 16mm x 20mm. - Is the Micron 2100AI/AT suitable for the Aerospace and Defence market?
Yes, it is ideally suited for this market due to its extended temperature range and robust data protection. - How can systems requiring more than 1TB of storage utilize these devices?
Systems can utilize multiples of these devices to achieve greater than 1TB of storage. - What specific application features does the Micron 2100AI/AT provide?
It provides namespace, autonomous power transitions, and boot emulation. - What type of NAND technology powers the Micron 2100AI/AT?
It is based on 64-layer triple-level cell (TLC) 3D NAND technology.
