Power Integrations Expands TOPSwitch

SAN JOSE, Calif. (PRWEB) July 17, 2008

The new “L” shaped lead-bend allows the company’s innovative eSIP package to lie flat against the printed circuit board with the heatsink pad facing upwards. The device stands just 2 millimeters above the board giving plenty of space for a heatsink and enabling extremely slender power supply designs.

The elegance of adapter designs enabled by the new package is demonstrated by a new reference design (DER-196) for a 65 W notebook adapter only slightly larger than a standard deck of playing cards. The design, which complies with the upcoming ENERGY STAR

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Ibrar Ayyub

I am an experienced technical writer holding a Master's degree in computer science from BZU Multan, Pakistan University. With a background spanning various industries, particularly in home automation and engineering, I have honed my skills in crafting clear and concise content. Proficient in leveraging infographics and diagrams, I strive to simplify complex concepts for readers. My strength lies in thorough research and presenting information in a structured and logical format.

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