SAN JOSE, Calif. (PRWEB) July 17, 2008
The new “L” shaped lead-bend allows the company’s innovative eSIP package to lie flat against the printed circuit board with the heatsink pad facing upwards. The device stands just 2 millimeters above the board giving plenty of space for a heatsink and enabling extremely slender power supply designs.
The elegance of adapter designs enabled by the new package is demonstrated by a new reference design (DER-196) for a 65 W notebook adapter only slightly larger than a standard deck of playing cards. The design, which complies with the upcoming ENERGY STAR