Power Integrations Expands TOPSwitch
SAN JOSE, Calif. (PRWEB) July 17, 2008 The new “L” shaped lead-bend allows the company’s innovative eSIP package to lie flat against the printed circuit board with the heatsink pad facing upwards. The device stands just 2 millimeters above the board giving plenty of space for a heatsink and enabling extremely slender power supply designs. […]
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