Summary of SelectConnect Technologies and LPKF USA Announce Joint Laser Direct Structuring (LDS) Webinar Series
This article announces a joint webinar by SelectConnect Technologies and LPKF Laser & Electronics on "3D Antennas on Plastic," focusing on Laser Direct Structuring (LDS). LDS involves laser etching circuitry onto doped thermoplastic components to create conductive paths, reducing assembly time, increasing yield, and minimizing part counts. The sessions cover LDS fundamentals, design considerations, real-world examples, and project initiation strategies for integrating 3D circuits into less space without heavy capital investment.
Parts used in the 3D Antennas on Plastic Project:
- Thermoplastic molded component
- Chassis
- Doping compound
- Laser system
- Metalization material
- Injection molded components
- Double-Shot molding parts
Palatine, IL (PRWEB) October 28, 2011
SelectConnect Technologies and LPKF Laser and Electronics announce a joint webinar series “3D Antennas on Plastic – Laser Direct Structuring of 3D Circuits”
Laser Direct Structuring (LDS) is a process in which circuitry and/or an antenna pattern are laser etched directly onto the surface of a thermoplastic molded component or chassis. The thermoplastic is “doped” with a compund that once laser activated accepts metalization creating a conductive path.
Cost savings associated with LDS are achieved through a reduction of assembly times, an increase of assembly yeild and a reduction in the number of parts.
This webinar will show how to put more function into less space using laser direct structured (LDS) 3-D circuitry without investing capital or spending a lot of time.
Discussions include:
Laser Direct Structuring (LDS): what it is, how it works
Design considerations
Real world examples of LDS to stimulate ideas
Getting started with a project
Dates for the webinar series are November 3, 8 and 17. Register to attend.
About SelectConnect Technologies
SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components and selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes scale up to high-volume production. Contact us to learn more about our processes and technologies. We are happy to help.
SelectConnect Technologies is ISO 9001 and ITAR registered. Visit us at SelectConnectTech.com
About LPKF Laser & Electronics
The LPKF Laser & Electronics AG develops systems and process solutions for demanding tasks in printed circuit board technology and microelectronics. Visit us at LPKF USA.
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More Electronic Circuits Press Releases
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What is Laser Direct Structuring?
It is a process where circuitry or antenna patterns are laser etched directly onto the surface of a thermoplastic molded component or chassis. -
How does the thermoplastic accept metalization?
The thermoplastic is doped with a compound that accepts metalization once it is activated by the laser. -
Can this process reduce assembly times?
Yes, cost savings are achieved through a reduction of assembly times and an increase in assembly yield. -
Does LDS allow more function in less space?
Yes, the webinar demonstrates how to put more function into less space using laser direct structured 3-D circuitry. -
What topics will be discussed in the webinar?
Discussions include what LDS is, how it works, design considerations, real world examples, and getting started with a project. -
Is capital investment required to start using LDS?
No, the technology allows for adding function without investing capital or spending a lot of time. -
Who provides LDS 3D-MID services in North America?
SelectConnect Technologies is the only contract provider of LDS 3D-MID services in North America. -
What types of projects does SelectConnect handle?
They work on projects ranging from early phase prototypes to scale up and high-volume production.
