Electrolock Introduces New Solder Pallet Material for Extreme Performance Applications
Hiram, Ohio (PRWEB) January 6, 2009 Electrolock-XP, a new solder pallet material, meets the demanding flatness and thickness requirements for soldering applications, reduces downtime and sets new standards for durable performance in lead-free and halide flux soldering systems. Electrolock-XP was manufactured in the United States using an innovative, patent-pending molding and processing technology. Electrolock-XP […]
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