SelectConnect Technologies and Val Tech Group Partner To Provide Three-Dimensional Molded Interconnect Device Solutions

Palatine, IL (PRWEB) December 30, 2011 SelectConnect Technologies, Palatine, Illinois and The Val Tech Group, Rochester, New York have partnered together to provide three-dimensional molded interconnect device (3D-MID) solutions. 3D-MID are alternatives for flex circuits, circuit boards, wiring and connectors that incorporate electronic circuits onto injection molded thermoplastic components for the medical device, mobile antenna, […]

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