MonolithIC 3D Inc. Announces Yield Repair Scheme for Wafer-Level 3D-ICs
San Jose, California (PRWEB) January 24, 2012 One of the commonly quoted challenges for wafer-level 3D-IC stacking is yield. When multiple wafers are stacked atop each other, yield of that 3D stack has the potential to reduce exponentially. For example, when four wafers with 70% yield are stacked atop each other, the net yield could […]
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