Posts by Bilal:
XENON DEVELOPMENT KIT
Posted on: 03 Sep 2020
Particle Industries endpoint and repeater development kit is designed for IoT projects and prototyping Particle’s Xenon is a powerful mesh-enabled development kit that can act as either an endpoint or repeater for Particle mesh networks. It is based on the Nordic nRF52840 and has built-in battery-charging circuitry so it is easy to connect a Li-Po and deploy a […]
Fast, Portable and Affordable Oscilloscope and Inductance Meter
Posted on: 03 Sep 2020
When turned off, it looks like an ordinary toy car that would entertain a kid for hours, but actually it is an oscilloscope kit in disguise! The idea and also part of the code for this project came from another scope called STM-32-O-Scope (aka pigScope), which uses a more powerful Arduino cousin called STM32. I originally posted […]
EEZ #BENCHBOX3
Posted on: 02 Sep 2020
EEZ teams recently announced their latest project; the EEZ Bench Box 3 (BB3). The Bench Box 3 which is a FOSS and open hardware programmable power supply concept was designed to serve as a successor to EEZ’s H24005, with the aim of providing a power supply with better modularity, higher capacity, and functionality while preserving openness, and rich software […]
XIAOMI WOWSTICK PRECISION MINI HANDHELD CORDLESS ELECTRIC SCREWDRIVER REVIEW
Posted on: 01 Sep 2020
Working on an electronics project or doing an electronics repair job is usually tedious and one of the contributing factors to this is the usual lack of the right tools for the necessary tasks including screwing and unscrewing parts. One approach to solve this problem was the development of electric screwdrivers and quite a lot […]
Micro Controlled Firework Rocket Launcher…
Posted on: 01 Sep 2020
Nowadays so many people, specially children just enjoy with the fire works carelessly so, I decided to create safety rocket launcher to minimize those damages instead of suggesting them Here I am showing how to make a cheap Arduino bluetooth Firework Rocket Launcher It’s simple to make and so easy to program. A unique design […]
INTRINSYC ANNOUNCES NEW PREMIUM-TIER SYSTEM ON MODULE BASED ON QUALCOMM TECHNOLOGIES’ SDA845 SYSTEM ON CHIP
Posted on: 31 Aug 2020
Designed for use in Advanced Robotics and Drones, Premium Camera Applications, Artificial Intelligence Platforms, and other Cutting-edge IoT Devices. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the Open-Q™ 845 µSOM (micro System on Module) and Development Kit, to be […]
TORADEX ANNOUNCES ITS APALIS SOM BASED ON THE NXP I.MX 8QUADMAX APPLICATIONS PROCESSOR
Posted on: 30 Aug 2020
Toradex, a leader in embedded computing, announced today general availability for its Apalis System on Module (SoM) based on the NXP® i.MX 8QuadMax applications processor. The SoM has been available as part of Toradex’s ‘early access’ program to its key partners and customers for several months and has a minimum product availability until 2030. The SoM is pin-compatible […]
Waren’s L.E.D Music Visualizer
Posted on: 30 Aug 2020
Another basic Arduino project is waiting for you to build! This exciting project will allow you to create an awesome L.E.D Music Visualizer using few components such as a Microphone module, resistors, L.E.Ds, and Arduino. This project is perfect for those who really loves music. Everybody loves music (including me) so that’s why I made one for my own entertainment […]
MICROCHIP SIMPLIFIES HARDWARE-BASED IOT SECURITY
Posted on: 29 Aug 2020
A pre-provisioned solution that provides secure key storage for low-, mid- and high-volume device deployments using the ATECC608A secure element is now available from Microchip Technology. According to the company, the Trust Platform for its CryptoAuthentication family enables companies of all sizes to implement secure authentication. The platform consists of a three-tier offering, providing out-of-the-box […]
SAMSUNG UNVEILS 12-LAYER 3D-TSV CHIP PACKAGING TECHNOLOGY
Posted on: 28 Aug 2020
An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @ eenewseurope.com Developed for the mass production of high-performance chips, the layered packaging technology requires pinpoint accuracy […]
