Development

Adiabatic Logic gains £500k (US$900k) DTI funding boost to accelerate development of power saving technology

CAMBRIDGE, England (PRWEB) September 29, 2004 Adiabatic Logic Limited (http://www.adiabaticlogic.com), a Cambridge-based company focused on creating and licensing intellectual property (IP) in the low power technology arena, has received a £500,000 (US$ 900k) funding boost from the UK Department of Trade and Industry (DTI). The Exceptional Research and Development Grant was awarded to Adiabatic Logic’s […]

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New SchmartBridge Program Creates New Level of Prototyping Development Flexibility and Cost Savings

Fremont, CA (PRWEB) October 11, 2004 One of the major differences between Schmartboard and competing prototyping boards is the SchmartBridge. This is the plastic piece that in conjunction with the holes on the sides of Schmartboards, allows one to physically connect the Schmarboards together. Some of our customers have rightly deduced that it would make

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Virtium Leads Working Group Development of Rugged Small Form Factor DIMM SFF-SIG Standard

Rancho Santa Margarita (Vocus/PRWEB) February 18, 2011 Virtium Technology Inc., a leading designer and manufacturer of long-life memory modules for mission-critical applications, today announced that its engineering senior management has played a leading role in the development of a new RS-DIMM Rugged Memory Specification for the Small Form Factor Special Interest Group (SFF-SIG). Helping designers

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School Improvement Network and QLD Partner to Incorporate S.M.A.R.T. Goals into Teacher Professional Development

Salt Lake City, UT (Vocus/PRWEB) March 01, 2011 Still bringing educators the most relevant, research-based best practices, School Improvement Network and QLD are extending the opportunity to learn and apply the framework that has driven success in schools nationwide.   Although defined differently in each industry, Anne Conzemius and Jan ONeill, co-founders of QLD, defined

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World Records in SoC for Wireless Sensing – CSEM and XEMICS Partnership Enables Excellence in Product Development

Neuchâtel (PRWEB) February 3, 2005 Wireless sensing has emerged as a major research topic in the recent years and is now triggering a growing demand for the deployment of low-power wireless sensor networks in customer applications. The ongoing collaboration between CSEM Centre Suisse d’Electronique et de Microtechnique SA and XEMICS in this field has resulted

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Atlassian Announces Big New Releases of Flagship Software Development and Collaboration Tools

San Francisco, CA (Vocus/PRWEB) March 16, 2011 Atlassian has released the latest versions of JIRA and Confluence, two software development and collaboration tools used by tens of thousands of product development teams globally. The new versions are more tightly integrated and introduce dozens of new features and fixes.   “Integration is a theme you’ll see

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Multi-Tech Announces Next Generation Cellular Development Platform

Minneapolis, MN (Vocus/PRWEB) March 22, 2011 Multi-Tech Systems, a world leading manufacturer of cellular modems for M2M (machine-to-machine) communications, announces the availability of its 3G Cellular Development Platform(CDP), an all-in-one hardware and OpenEmbedded Linux development environment. Companies looking to add M2M communications to their applications, can leverage the CDP, a complete, application-ready hardware solution that

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MEMtronics Receives Missile Defense Agency Contract for Tunable Filter Development

(PRWEB) March 20, 2005 This contract is for the first phase of a Small Business Innovation Research (SBIR) project sponsored by the Department of Defense. This program’s focus is on developing innovative microelectromechanical systems (MEMS) devices and circuits which uniquely support the requirements for tunable filters in transmit applications.   This six month contract will

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MEMtronics Receives Phase 2 Award for DARPA RF MEMS Switch Development – Company’s technology increases environmental robustness of wireless systems

(PRWEB) May 5, 2005 Part of the Harsh Environment Robust Micromechanical Technology (HERMIT) Program, the first phase of this contract recently culminated in the successful demonstration of a wafer-level packaging technology called “wafer-level microencapsulation.” This packaging scheme protects MEMS switches from the adverse effects of moisture and particles. The microfabricated packages have extremely low loss

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