Patent

Four Brinks Attorneys Named Leading Patent Litigators by Intellectual Asset Management Patent Litigation 250

Chicago, Ill. (PRWEB) April 26, 2011 Gary M. Ropski, James R. Sobieraj, Meredith Martin Addy and Thomas J. Filarski of Brinks Hofer Gilson & Lione were named leading patent litigators in the inaugural issue of Intellectual Asset Management Patent Litigation 250 The Worlds Leading Patent Litigators, which covers all the world’s major patent litigation jurisdictions […]

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Lee & Hayes Again Earns Top Spot in Patent Quality Rankings LeMond Appointed to Head New Portland Metro Office

Spokane, WA (PRWEB) May 23, 2011 For the second consecutive year, Lee & Hayes, pllc, has been ranked no. 1 in the U.S. in patent quality, and no. 1 in the information technology industry, by Intellectual Asset Management Magazine (IAM) and Ocean Tomo Patent Ratings. Patent quality is a stronger measure of an intellectual property

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Carr & Ferrell LLP Patent Group to Exhibit at DAC 2011 in San Diego

San Diego, CA (PRWEB) June 06, 2011 Carr & Ferrell LLP (http://www.carrferrell.com), a premier Silicon Valley-based intellectual property and corporate law firm, is pleased join the exhibitors at this years Design Automation Conference (DAC) in San Diego, which begins today and continues through Thursday.   The conference, now in its 48th year, is focused on

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John W. Olivo, Jr. Announces the Formation of Olivo Law Group, P.C. and Olivo Patent Group, LLC

Birmingham, AL (PRWEB) June 30, 2011 John (Jack) W. Olivo, Jr. was a founding partner of the intellectual property law firm of Ward & Olivo, which had offices in New York City, Summit, New Jersey, Marshall, Texas, Dallas, Texas and Hartford, Connecticut. The firm, founded in 1992 and strategically dissolved in 2011, handled a wide

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Bead Electronics Granted Patent for Hybrid Interconnect Pin

Milford, CT (PRWEB) January 10, 2012 Bead Electronics was granted US patent no. 8,087,281 B2 on January 3rd for its innovative True Grip interconnect pin. Bead’s True Grip pin is a hybrid design that combines the strength and reliability of through hole interconnects with the ease of surface mount processing. Bead’s design is the

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