(PRWEB) December 12, 2004 The USB 2.0 IDE Application Device IC is available in a 128 pin QFP package with an industry standard UTMI interface for physical layer connectivity. The device operates at a frequency of 60MHZ and interfaces to industry standard 8051 compatible microcontrollers to offer a truly low cost high value solution. Specsoft’s […]
Specsoft Announces Successful USB 2.0 IDE Application Device IC Read More »
San Jose, CA (PRWEB) March 15, 2012 Radicom Research, a modem industry leader, announced today the release of the WiFiHU2 series of USB WiFi modem modules. The WiFiHU2 modules provide easy WiFi connectivity through any processor-based device. With support for the latest wireless standards — including 802.11b/g/n — and USB 2.0 connectivity, the WiFiHU2 offers
New WiFi Modules Feature Soft AP Support For Easy HotSpot Device Integration Read More »
Oslo, Norway (PRWEB) June 15, 2005 At the ZigBee Alliance Open House in Oslo, Norway, Jennic today announces the general availability of development kits using network protocol stacks from two of its partners, and demonstrates the first solutions for industrial, building and home automation applications based on its single chip IEEE802.15.4 device. Using the evaluation
Las Vegas, NV (PRWEB) September 14, 2011 Smart Geek Products LLC is pleased to announce the release of MyBlueBoost; a portable, compact battery charger that will typically power a cell phone for 12 to 16 hours. MyBlueBoost isnt just for cell phones. It will also charge devices such as the Nook, PSP, iPods and Zunes.
CHICAGO (PRWEB) July 8, 2008 Dataman’s range of universal, specialized and gang programmers, that are designed for use with prototyping and production quantities of microcontrollers, memory chips and programmable logic devices (PLDS), are available for same-day shipping at http://www.newark.com/dataman Included in this offering are the latest programmers, which can support USB 2.0 connectivity, in-system programming
Newark and Device Programmer Dataman Sign Exclusive Distribution Agreement Read More »
Boston, MA (PRWEB) April 24, 2012 James Bleck, president of Bleck Design Group and Matthew Hickcox, president of Odic Incorporated will present: “Android Tablets and Phones: the Core of Your Next Medical, Laboratory, or Business Device” during the Design & Manufacturing New England expo at the Boston Convention Center on Thursday, April 26, 2012. They
Developing Your Next Medical, Laboratory, or Business Device Using an Android Platform Read More »
London, UK (PRWEB) April 24, 2012 GlobalSign (http://www.globalsign.co.uk), one of the leading providers of Digital Certificates worldwide, is pleased to be able to demonstrate its new iOS Identity Certificates for iOS Device Authentication at Infosecurity Europe 2012, London. iOS Identity Certificates are designed specifically for use with iOS devices (iPad, iTouch, iPhone, etc.) to allow
GlobalSign Demonstrates iOS Device Authentication Solution for the Enterprise Read More »
Seattle, Wa (PRWEB) April 28, 2012 The Wingz Smartkeyboard has a touchscreen embedded in the middle of it. (Photo credit: Arc Inc.) By including a small touchscreen in the middle of a split, ergonomically designed keyboard, the Wingz Smartkeyboard aims to increase productivity by allowing computer users to multitask better by adding one more screen
Kickstarter Project ‘Wingz Smartkeyboard’ Creates Hybrid Touchscreen-Keyboard Device Read More »
Blacksburg, VA (PRWEB) December 13, 2011 MicroXact Inc. introduces the new MPS-C-300 and MPS-C-350 magnetic probe stations. With arbitrary user-defined orientation and profile of the applied magnetic field these affordable probe stations provide unmatched throughput and characterization capabilities for spintronic and magneto-electronic devices and circuits. These first-of-their-kind systems offer wafer-size testing capabilities with convenient and
Wafer-scale Device Probing is Now Possible in a 3D-controlled Magnetic Field Read More »
Palatine, IL (PRWEB) December 30, 2011 SelectConnect Technologies, Palatine, Illinois and The Val Tech Group, Rochester, New York have partnered together to provide three-dimensional molded interconnect device (3D-MID) solutions. 3D-MID are alternatives for flex circuits, circuit boards, wiring and connectors that incorporate electronic circuits onto injection molded thermoplastic components for the medical device, mobile antenna,
