Interconnect

SelectConnect Technologies and Val Tech Group Partner To Provide Three-Dimensional Molded Interconnect Device Solutions

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Palatine, IL (PRWEB) December 30, 2011 SelectConnect Technologies, Palatine, Illinois and The Val Tech Group, Rochester, New York have partnered together to provide three-dimensional molded interconnect device (3D-MID) solutions. 3D-MID are alternatives for flex circuits, circuit boards, wiring and connectors that incorporate electronic circuits onto injection molded thermoplastic components for the medical device, mobile antenna, […]

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Bead Electronics Granted Patent for Hybrid Interconnect Pin

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Milford, CT (PRWEB) January 10, 2012 Bead Electronics was granted US patent no. 8,087,281 B2 on January 3rd for its innovative True Grip interconnect pin. Bead’s True Grip pin is a hybrid design that combines the strength and reliability of through hole interconnects with the ease of surface mount processing. Bead’s design is the

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The World’s Premiere Source for Information on 3-Dimensional Molded Interconnect Devives – 3dmid Blog is Now Part of SelectConnectTech.com

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Palatine, IL (PRWEB) March 28, 2012 3-D MID blog, the Worlds premiere source for information regarding 3-Dimensional Molded Interconnect Devices (3-D MID) becomes wholly integrated into SelectConnectTech.com   SelectConnect Technologies is honored to be entrusted with the continuation of such a respected information source to the 3-D MID industry.   3-D MIDs are formed through

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Early Registration for the 2012 IEEE International Interconnect Technology Conference Is Open

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San Jose, CA (PRWEB) May 11, 2012 The Program Committee for the 15th Annual IEEE International Interconnect Technology Conference (IITC) and Exhibition encourages all who plan to attend the 2012 IITC held June 4-6th at the DoubleTree Hotel in San Jose, CA and preceded by a Short Course on Sunday, June 3 to take advantage

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